Highlighting Eco-Friendly AI Cooling Strategies at PTC 2025 in Honolulu by ZutaCore
In the rapidly evolving world of technology, the need for sustainable and efficient cooling solutions has never been more pressing. Enter ZutaCore's HyperCool, a groundbreaking waterless cooling technology designed to meet the high demands of AI workloads and telecommunications infrastructure.
Waterless, Direct-to-Chip Cooling
HyperCool employs a waterless, direct-to-chip liquid cooling system, which eliminates the reliance on scarce water resources and reduces the risk of water-related issues such as corrosion, mold, and bio-growth. This innovative approach is particularly beneficial in high power density applications common in AI workloads and telecom infrastructure.
Two-Phase Cooling Loop
The heart of HyperCool's cooling efficiency lies in its two-phase cooling loop. In this system, a liquid absorbs heat and vaporizes, then is condensed and recirculated. This process enables highly efficient heat removal, making HyperCool an ideal choice for managing the temperature of high-performance processors and AI GPUs like NVIDIA's Grace Blackwell superchip and the AMD Instinct MI300X.
100% Heat Reuse
One of the most significant advantages of HyperCool is its ability to harness the heat generated from AI factories and reuse it. This 100% heat reuse not only improves energy efficiency but also supports sustainable, net-zero data center operations. Telecom providers can use this reclaimed heat for heating adjacent offices, other parts of the data center, or nearby schools, office buildings, and swimming pools.
Smart Controls and DCIM Integration
HyperCool is equipped with smart controls for auto-regulated flow, temperature, and pressure. It also offers remote monitoring and seamless integration with data center infrastructure management (DCIM) systems. These features simplify management and enhance operational safety, making HyperCool a reliable and easy-to-manage solution.
Scalability and Safety
HyperCool is designed to scale and address the cooling challenges posed by increasing power densities in modern telecommunications facilities and AI data centers. Its scalability ensures that it can grow with the needs of your AI factory, providing a future-proof cooling solution.
Cost Savings and Energy Efficiency
HyperCool delivers 10-20% better energy efficiency with dynamic cooling, smaller pumps, and no performance degradation over time. This means lower energy costs for telecom providers, which can be redirected to the compute infrastructure, generating more revenue for AI factories.
Sustainability and Compute Density
HyperCool has been proven to cool the hottest chips of 2,800 watts with a data center PUE (power usage effectiveness) as low as 1.05-1.07, increasing compute density. Its heat re-use capabilities allow for the cooling of AI GPUs up to 2,800 watts and beyond without the need for water or heat pumps.
Server Densification and Space Efficiency
HyperCool enables higher server densification needed in AI factories, consuming up to 50% less space than air-cooled data centers and up to 75% less space than immersion cooling. This space efficiency makes HyperCool an attractive choice for telecom providers and AI factory operators looking to maximize their data center footprint.
The Future of Cooling: Sustainable and Efficient
In an industry where sustainability and efficiency are paramount, HyperCool provides a sustainable, efficient, and reliable cooling solution that aligns with industry trends towards higher power density and environmental responsibility. ZutaCore will be showcasing HyperCool at the 2025 Pacific Telecommunications Council (PTC) in Honolulu, Hawaii from January 19-22.
[1] For more information about ZutaCore's HyperCool, visit www.zutacore.com/hypercool.
[3] For technical details about ZutaCore's HyperCool, refer to www.zutacore.com/technology.
science plays a crucial role in developing the HyperCool, a waterless, direct-to-chip cooling technology that addresses the high demands of AI workloads and telecommunications infrastructure. This environmental-science innovation, which employs a two-phase cooling loop, offers advantages like 100% heat reuse for sustainable, net-zero data center operations and 10-20% better energy efficiency. The technology also integrates with data-and-cloud-computing systems, ensuring scalability, cost savings, and ease of management. As the future of cooling, HyperCool prioritizes sustainability and efficiency in an effort to meet industry trends towards higher power density and environmental responsibility.
