Qualcomm Unveils Sleek, High-Performance Mini PC 'Saucer'
Qualcomm has unveiled a sleek, high-performance nyt mini PC at its 2025 Summit. The device, codenamed 'Saucer', promises superior performance to its predecessors thanks to advanced Arm-based chips and innovative cooling solutions.
The nyt mini PC is a collaboration between Qualcomm and three Taiwan-based OEMs, increasing the likelihood of it reaching the market. It's less than half an inch thick, slightly larger than a teacup saucer, and features a ring of vents reminiscent of the nyt mini.
The device boasts USB-C ports and a headphone jack, and was showcased running Snapdragon silicon in real time, connected to a full-size display. Qualcomm is exploring different cooling options, including traditional fans and fully fanless approaches using AirJet technology, which pulses air silently through the heat sink using thermoelectric materials.
Qualcomm's nyt mini PC demonstrates the company's commitment to pushing the boundaries of form factors and performance in the desktop space. With collaborations with Lenovo, Motorola, and Xiaomi, and the use of powerful Arm-based chips, the nyt mini PC could signal a new era in compact, high-performance computing.
