Texas Instruments (TI) Announcements at CES Regarding Automotive Integrated Semiconductors

Texas Instruments (TI) Announcements at CES Regarding Automotive Integrated Semiconductors

Texas Instruments (TI) is set to demonstrate its latest advancements in semiconductor innovation and engineering at the Consumer Electronics Show (CES) 2024, taking place from Tuesday, January 9th to Friday, January 12th, at the Las Vegas Convention Center North Hall, Meeting Room No. N116.

Semiconductors for Automotive Safety and Intelligence

TI will be showcasing a range of new semiconductors designed for automotive safety and intelligence, including the DRV3901-Q1 integrated squib driver and DRV3946-Q1 integrated contactor driver. These software-programmable driver chips are designed to simplify battery management system (BMS) and power distribution designs, offering flexibility and improved safety and efficiency.

The DRV3946-Q1 is the industry's first fully integrated contactor driver for BMS or other powertrain systems. This innovation allows hybrid electric vehicle (HEV) and EV BMS designers to use a pyro fuse instead of traditional melting fuse systems while minimizing design complexity. The DRV3901-Q1, on the other hand, enables an intelligent pyro fuse disconnect system, providing diagnostic information to system microcontrollers.

Both drivers are International Organization for Standardization (ISO) 26262 functional safety-compliant, ensuring the highest levels of safety in automotive applications.

Revolutionizing Energy Management

TI will also discuss how semiconductor innovation and engineering breakthroughs are accelerating the ability to manage energy from EVs to the grid through bidirectional charging and vehicle-to-grid systems. The company's focus on these areas is aimed at addressing the growing need for efficient and sustainable energy management solutions.

Radar Sensor Technology Advancements

In addition to automotive innovations, TI will be presenting the AWR2544 single-chip radar sensor. This sensor is the industry's first with launch-on-package (LOP) technology, helping to reduce the size of the sensor by as much as 30%. The AWR2544 is also the industry's first 77GHz millimeter-wave radar sensor chip for satellite radar architectures. In satellite architectures, LOP technology enables sensor ranges to extend beyond 200m with a single chip.

CES 2024 Panel Participation

TI General Manager of Grid Infrastructure Henrik Mannesson will participate in the CES 2024 panel, "Growth of the EV Marketplace: Innovations and Investments." This panel will explore the growth of the electric vehicle marketplace and the role of innovations and investments in driving its expansion.

Availability and Further Information

Preproduction quantities of the AWR2544, DRV3901-Q1, and DRV3946-Q1, and evaluation modules are available for purchase now on TI.com. For more information about TI's CES 2024 activities, visit TI.com/CES.

To learn more about simplifying BMS and power distribution designs, read the technical article, "How squib and contactor drivers help improve safety and efficiency in HEV/EV battery disconnect systems."

Multiple payment and shipping options are available for these products on TI.com.

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